Accessible, flexible, cost-effective laser manufacturing
Laser Machining of Silicon
Silicon, being the most mature material in the semiconductor industry, is widely used as a platform for many devices. As new products are developed, many sectors are demanding the machining of silicon-based chips or of devices held on silicon substrates.
The discrete machining of silicon wafers (scribing, cutting or drilling) or micro-structuring of on-wafer devices can be provided by LML with high quality.
30mm disc cut from 525 micron thick silicon wafer.
Edge quality from 525 micron thick silicon wafer.
Laser cutting of silicon wafers.
Laser diced silicon wafers with 50 micron thick sample in centre.
Micromilling of silicon.
Precision cutting of silicon wafers.
Silicon.
250um holes in 500um thick silicon wafer.