SILICON
Milling
480μm deep nozzles plates (680μm thick) 
10mm well plates (525μm thick) 
Counter-sunk 20mm hole (380μm thick) 
Etched reflective aperture (680μm thick) 
475μm deep stepped holes (500μm thick) 
5mm pocket (500μm deep) 
Fluidic mixer 
1mm stepped sqrs (525μm thick)